What is DPA Testing?

On these pages we often discuss in detail individual climate tests aimed at verifying the conformity of materials and products.

Often, however, tests on products and materials are not performed individually but organized into protocols that aim to examine every possible weakness of a given sample. 

This is the case of DPA Testing.

What is DPA Testing for?

As we have said, DPA Testing is more of a protocol than a test, that is, a set of various types of tests to be performed in succession on a sample to verify its resistance to all factors that could undermine its functioning.

DPA stands for Destructive Physical Analysis, indicating the intensity of the stresses to which the sample will be subjected.

DPA Testing is primarily concerned with the military and aerospace and, more specifically, the sophisticated electronic components used in this field.

The rigorous tests that make up the DPA Testing protocol serve to prevent the so-called “infant mortality” of electronic components , which is one of the main problems encountered in the production of such delicate devices.

By performing DPA Testing, we prevent defective components from reaching the assembly stage and, at the same time, we identify recurring malfunctions that will then need to be addressed in the design stage.

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How DPA Testing Works

As we have said, DPA Testing is a protocol composed of a wide variety of tests that must prevent any type of malfunction that electronic components may encounter.

The number and type of tests are generally referred to in the standards produced by MIL-STD, the United States Military Standard. 

The standards that concern DPA Testing are: MIL-STD-883, MIL-STD-1580B, MIL-STD-750E, MIL-STD-202G.

As outlined in MIL-STD-883, the tests that make up DPA Testing can be divided into four categories: environmental testing, mechanical testing, digital electrical testing, and linear electrical testing. 

Among the tests that fall into the environmental testing category, we find several procedures that we have already discussed on these pages, such as the Burn-In Test on electronic boards.

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The FDM Environmental Chamber for DPA Testing

To perform the entire first part of the DPA protocol tests, that is, the environmental tests, there is no better tool than an environmental chamber.

Among climatic chambers, environmental chambers are the most used in the military and aerospace sectors because they are specialized in so-called extreme tests: climatic tests that reach very high values ​​of temperature and relative humidity.

FDM environmental chambers have a temperature range between -70/180°, and a relative humidity regulator that reaches 98°.

Our environmental chambers also implement the innovative revoFACE, ideal for dynamic tests involving electronic components.

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Reference Standards

• MIL-STD-1580 — Destructive Physical Analysis for Electrical, Electromechanical, and Electromechanical Parts. Primary DPA standard for electronic components for military and space applications.
• MIL-STD-883 Method 5009 — Destructive Physical Analysis, Reference Method for Microcircuits.
• MIL-STD-750 Method 2101 — DPA for Discrete Semiconductor Devices.
• ECSS-Q-ST-60-05C — ESA Space product assurance – Generic procurement requirements for hybrids, including DPA requirement on lot sample.
• AS9102 — Aerospace First Article Inspection Requirement, calls DPA for qualification lot.
• AEC-Q100 / Q101 — Failure Mechanism Based Stress Test Qualification for Automotive ICs and Discretes, with DPA as the Construction Validation Test.
• JESD47 — Stress-Test-Driven Qualification of Integrated Circuits, a JEDEC reference complementary to DPA.

Authoritative Sources

• DLA – Defense Logistics Agency. Publishing body of MIL-STD-1580, MIL-STD-883, MIL-STD-750.
• ECSS – European Cooperation for Space Standardization. Maintains the ECSS-Q-ST series applicable to space component qualification.
• Automotive Electronics Council (AEC). Publishes AEC-Q100/Q101/Q104 automotive specifications.
• JEDEC Solid State Technology Association. JESD47 and related standards for qualification IC.

Frequently Asked Questions about DPA Testing

What does a DPA analysis include and in what order is it performed?

DestructivePhysical Analysis according to MIL-STD-1580 is an ordered sequence of non-destructive and destructive tests to validate the internal construction of an electronic component. The typical order is: (1) external visual inspection (10x-40x stereo); (2) X-ray (voltages 60-160 kV, resolution 5-50 μm) for wire bonds, voids, contamination; (3) PIND (Particle Impact Noise Detection) for mobile particles; (4) fine/gross leak test (helium, fluorocarbon); (5) RGA if applicable; (6) package opening (mechanical delidding, chemical HNO₃/H₂SO₄, plasma O₂/CF₄); (7) internal visual (SEM 50x-5000x); (8) bond pull and die shear; (9) metallographic cross-section to check metallization thicknesses, wire bonds, welds.

What sample size does MIL-STD-1580 require for DPA?

MIL-STD-1580 specifies Lot Acceptance DPA with sampling typically of 2-5 pieces per production lot, in addition to 100% electrical testing. For Class S space (JESD47/MIL-PRF-38535), the frequency can be 1 lot per wafer diffusion. The manufacturer must maintain records for a minimum of 7 years and photographic/micrographic evidence of each step. DPA fallout (detected defects) generates non-conformity action with 100% screening of the lot or rejection. Acceptance criteria: wire bond height ≥ 2x wire diameter, metal coverage > 50% on the steps, die attach solder voids < 25% total area and < 10% single void. Measurement uncertainty is documented according to ISO/IEC 17025.

How are bond pull and die shear tests performed?

The wire bond pull test (MIL-STD-883 Method 2011) applies increasing tensile force to wire bonds with a hook positioned midway through the loop until failure occurs. Minimum force values ​​depend on the diameter: Au 25 μm ≥ 3 grams, Au 33 μm ≥ 5 grams, Al 25 μm ≥ 2.5 grams, Cu 25 μm ≥ 3 grams. Failure mode must be mid-span, NOT at the neck (ball bond) or at the heel (wedge bond). The die shear test (Method 2019) applies lateral force parallel to the substrate to evaluate die-attach solder quality. For 4 mm² die, the minimum is 2.5 kg, increasing with area according to MIL table. Preferred failure mode: interfacial pad-solder ≥ 50%, brittle die failure indicating excellent solder. Typical equipment: DAGE 4000, Nordson. Annual calibration with E2 class certified weights according to OIML R111.

In which cases does mandatory vs. recommended DPA apply?

Mandatory DPA is required for: Class H/K MIL-STD-883 components, Class B/Class S space components (ECSS/ESA), AEC-Q100 Grade 0 automotive safety-critical parts (≥ 150 °C), Class III implantable medical devices (ISO 13485 + 21 CFR 820), DAL-A avionics (DO-254 FPGA/ASIC). For industrial and consumer products, it is recommended but not mandatory , with execution on a Lot Audit during initial qualification or on an investigation failure analysis. DPA reveals issues invisible to electrical testing: die attach delamination (propagation 10-50 μm/thermal cycle), Kirkendall voids in Au-Al wire bonds (accelerated aging > 150 °C), tin whisker on RoHS terminals (length > 50 μm due to short), Cu-Al galvanic corrosion with residual moisture > 5000 ppm (vs MIL-STD-883 Method 1018).