IEC 60068-2-1: Complete Guide to Cold Testing of Components

IEC 60068-2-1 , known as Test A (Cold test) , defines procedures for testing the ability of components, equipment, and materials to withstand and function at low temperatures . From qualifying semiconductors at -65°C to testing equipment for arctic environments, this standard is the international reference for cold testing.

In this guide, we analyze the three test variants, the required conditions, and the FDM thermostatic chambers designed to achieve these ranges with precision.

What is IEC 60068-2-1 and what does it test?

Low temperatures can compromise an electronic device in many ways: increased viscosity of lubricants, embrittlement of plastics and seals, changes in the electrical characteristics of semiconductors, differential contraction between materials with different coefficients of thermal expansion.

IEC 60068-2-1 serves to verify that the product:

• survives low temperatures (no cracking, deformation or breakage)
• Functions correctly when powered cold (for dissipative variants)
• Recover performance after returning to chamber temperature

The three variants of Test A

Variant Ab — Non-dissipative cold (sample off)

The sample is not powered during cold exposure. Mechanical and structural effects are evaluated: cracks, delamination, permanent deformations, and loss of seal tightness.

Procedure:

1. The sample is brought to the test temperature with a gradient not exceeding 1°C/min (unless otherwise specified)
2. It maintains the temperature for the specified duration (from 2 to 96 hours)
3. The sample is brought back to chamber temperature
4. We wait for stabilization and perform functional and visual checks

Variant Ad — Dissipative cold (powered sample)

The specimen is powered and operational during the test. Self-heating of the device is taken into account: the chamber must compensate for the heat generated to maintain the surrounding air temperature at the specified value.

Typical applications: checking the correct functioning of automotive ECUs at -40°C, cold start testing of engine control units, checking displays and sensors in outdoor environments.

Variant Ae — Cold with gradual variation

Similar to the Ab, but with a controlled and specific temperature gradient to simulate real-world cooling conditions. The rate of change is defined in the product specification.

Test conditions and severity

Required tolerances: ±2°C on the test temperature, measured in the air surrounding the sample (not on the sample surface).

Application sectors

• Electronics and semiconductors: Component qualification according to JEDEC (JESD22-A119) and AEC-Q100 for automotive
• Aerospace and Defense: Complementary to MIL-STD-810 Method 502 for Cold Testing of Equipment
• Telecommunications: antennas, base stations and outdoor equipment in Nordic climates
• Batteries: checking the performance of lithium-ion cells at low temperatures (capacity, internal resistance)
• Medical: Portable and emergency devices that must operate under extreme conditions

IEC 60068-2-1 FDM cold test chambers

FDM Environment Makers offers negative range chambers suitable for all standard severities:

The T-PRO and FDM Environmental chambers reach -70°C, comfortably exceeding the maximum severity (-65°C) of the standard. The programmable controller allows you to set cooling ramps that comply with the product specification requirements.

Learn more: Discover our low-temperature battery test chamber, designed and manufactured by FDM Environment Makers.

Frequently Asked Questions about IEC 60068-2-1

What is the difference between IEC 60068-2-1 and EN 60068-2-1?

There are no technical differences. EN 60068-2-1 is the European version of the IEC standard, adopted identically by CENELEC. The requirements and procedures are the same.

Can I use the same chamber for cold and heat testing?

Yes. FDM environmental chambers with a range of -70°C to +180°C cover both IEC 60068-2-1 (cold) and IEC 60068-2-2 (dry heat), allowing both tests to be performed with a single chamber.

How is temperature measured during the test?

The standard requires that the temperature be measured in the air surrounding the sample, not on its surface. FDM chambers are equipped with calibrated PT100 sensors positioned in the working volume. For dissipative samples (variant Ad), it is necessary to verify that self-heating does not alter the air temperature beyond the tolerances.

Reference Standards

• IEC 60068-2-1 — Environmental testing – Part 2-1: Tests – Test A: Cold. Reference standard for cold testing of non-dissipative (Test Ab) and dissipative (Test Ad) components, with typical temperatures from -10°C to -65°C.
• IEC 60068-2-14 — Test N: Change of temperature. Complementary to Test A when the profile requires rapid transitions to cold conditions.
• IEC 60068-3-1 — Supporting documentation and guidance – Cold and dry heat tests. Application guidelines for the correct selection of the Ab/Ad method and conditioning duration (typically 2, 16, 72, or 96 hours).
• MIL-STD-810H Method 502.7 — Low Temperature. U.S. military method for storage (-46 C / -33 C) and operational (-32 C / -21 C) tests of ground, naval, and aircraft equipment.
• JESD22-A119 — Low Temperature Storage Life. JEDEC standard for reliability qualification of low-temperature semiconductors.
• ISO 16750-4 — Road vehicles – Climatic loads. Recalls IEC 60068-2-1 for the qualification of automotive components with severity classes -40 C / -30 C / -20 C.
• ETSI EN 300 019-2-1 — Environmental tests for telecommunications equipment – ​​Storage. Applies IEC 60068-2-1 with specific profiles for TLC equipment (classes T1.1, T1.2, T1.3).

Authoritative Sources

• IEC – International Electrotechnical Commission. Publishes the globally recognized IEC 60068 series for climatic testing.
• ACCREDIA. Accredits Italian laboratories for IEC 60068-2-1 testing according to ISO/IEC 17025.
• ILAC. Ensures the international recognition of test certificates.
• JEDECPublishes JESD22-A119 and Low-Temperature Storage Qualification Practices for Semiconductors.